Nvidia transitions to advanced CoWoS-L chip packaging, signaling a major shift for TSMC
artificialrace.com Estimated reading time: 1 minutes
Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang explained the transition in Nvidia’s chip packaging requirements. “As we move into Blackwell, we will use largely CoWoS-L. Of course, we’re still manufacturing Hopper, and Hopper will use CoWoS-S. We will also…
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